Full specifications
| PCB dimensions (mm) | Single-laneBatch mounting2-positin mountingDual-laneDual transfer (Batch)Dual transfer (2-position)Single transfer (Batch)Single transfer (2-position |
|---|---|
| Placement Head max Speed | 38 500cph (0.094 s/ chip) |
| Placement Head Placement Accuracy (Cpk≧1) | ±40 μm / chip |
| Placement Head Component Dimensions (mm) | 0402 chip ~ L 6 x W 6 x T 3 |
| Dispensing Head | Dispensing speed:Dot dispensing: 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) Draw dispensing: 4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9Adhesive position accuracy (Cpk≥1) Dot Dispensing: ± 75 μ m /dot Draw Dispensing: ± 100 μ m /componentApplicable components Dot Dispensing: 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP Draw Dispensing: BGA, CSP |
| Resolution | 2D inspection head (A)18 µm |
| View Size (mm) | 44.4 x 37.2 |
| Inspection Processing Time | Solder Inspection 0.35s/ View sizeComponent Inspection 0.5s/ View size |
| Inspection Object | Solder InspectionChip component: 100 μm × 150 μm or more (0603 or more)Package component: φ150 μm or moreComponent Inspection: Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector |
| Inspection Items | Solder Inspection:Oozing, blur, misalignment, abnormal shape, bridgingComponent Inspection:Missing, shift, flipping, polarity, foreign object inspection |
| Inspection Position Accuracy | ± 20 μm |
| No of Inspection | Solder Inspection : Max. 30 000 pcs./machine (No. of components :Max. 10 000 pcs./machine)Component Inspection: Max. 10 000 pcs./machine |
| Component Supply Taping | Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mmMax.120 (Tape: 4, 8 mm) |
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